JPH0244352U - - Google Patents

Info

Publication number
JPH0244352U
JPH0244352U JP1988122914U JP12291488U JPH0244352U JP H0244352 U JPH0244352 U JP H0244352U JP 1988122914 U JP1988122914 U JP 1988122914U JP 12291488 U JP12291488 U JP 12291488U JP H0244352 U JPH0244352 U JP H0244352U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
resin layer
insert plate
external leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988122914U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0737319Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988122914U priority Critical patent/JPH0737319Y2/ja
Publication of JPH0244352U publication Critical patent/JPH0244352U/ja
Application granted granted Critical
Publication of JPH0737319Y2 publication Critical patent/JPH0737319Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988122914U 1988-09-20 1988-09-20 混成集積回路装置 Expired - Lifetime JPH0737319Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988122914U JPH0737319Y2 (ja) 1988-09-20 1988-09-20 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988122914U JPH0737319Y2 (ja) 1988-09-20 1988-09-20 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPH0244352U true JPH0244352U (en]) 1990-03-27
JPH0737319Y2 JPH0737319Y2 (ja) 1995-08-23

Family

ID=31371292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988122914U Expired - Lifetime JPH0737319Y2 (ja) 1988-09-20 1988-09-20 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPH0737319Y2 (en])

Also Published As

Publication number Publication date
JPH0737319Y2 (ja) 1995-08-23

Similar Documents

Publication Publication Date Title
JPH0244352U (en])
JPH0270447U (en])
JPS5858342U (ja) 混成集積回路
JPS614436U (ja) 半導体装置用パツケ−ジ
JPS5933254U (ja) 半導体装置
JPS594642U (ja) 混成集積回路基板封止体
JPS6416641U (en])
JPS5952665U (ja) 混成集積回路
JPH0231149U (en])
JPS6234445U (en])
JPS60149163U (ja) 半導体装置
JPS6041054U (ja) 集積回路用パッケ−ジ
JPS63178383U (en])
JPH0359640U (en])
JPS61192480U (en])
JPS63165854U (en])
JPH0336141U (en])
JPS60179065U (ja) プリント回路基板
JPH0353872U (en])
JPS588946U (ja) 半導体装置
JPS6365245U (en])
JPS59185851U (ja) 半導体集積回路装置
JPS5920641U (ja) 半導体装置
JPH02122436U (en])
JPH02146835U (en])